
STM32F302xB STM32F302xC
Package information
7.4
WLCSP100 - 0.4 mm pitch wafer level chip scale package
information
Figure 48.WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale
package outline
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DocID025186 Rev 7
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