
Package information
STM32L151xC STM32L152xC
Table 72. WLCSP63, 0.400 mm pitch wafer level chip size package mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.540
0.570
0.600
0.0213
0.0224
0.0236
A1
-
0.190
-
-
0.0075
-
A2
-
0.380
-
-
0.0150
-
A3
-
0.025
-
-
0.0010
-
Øb
0.240
0.270
0.300
0.0094
0.0106
0.0118
D
3.193
3.228
3.263
0.1257
0.1271
0.1285
E
4.129
4.164
4.199
0.1626
0.1639
0.1653
e
-
0.400
-
-
0.0157
-
e1
-
2.400
-
-
0.0945
-
e2
-
3.200
-
-
0.1260
-
F
-
0.414
-
-
0.0163
-
G
-
0.482
-
0.0190
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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DocID022799 Rev 13