CS61881-IB データシートの表示（PDF） - Cirrus Logic
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CS61881-IB Datasheet PDF : 28 Pages
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CS61881
160-BALL FBGA (2 LAYER) PACKAGE DRAWING
A
15.00/M+3A1BE0.20
Pin #A1 Corner
13.00 ± 0.20
B
15.00/M+3A1BE0.20
13.00 ± 0.20
A
Pin #A1 Identifier (shiny)
∅1.00x0.15 Depth
A
3.0°
4.72 ±0.10
8xR0.5
3
Seating Plane
0.20 (4x)
3x∅1.00
1.00 REF
2
0.50 ± 0.10
A
B
∅0.30 M C A B
C
∅0.10 C
D
E
F
G
H
I
J
K
L
M
4.72 ± 0.10
TOP VIEW
13.00
1.00
4x1.20x45
1.00
13.00
0.36 ± 0.04
0.85
0.40 ± 0.10
1.61 ± 0.19
SIDE VIEW
14 13 12 11 10 9 8 7 6 5 4 3 21
BOTTOM VIEW
1.00 REF
JEDEC #: MO-158
Notes: 14. All dimensions and tolerance conform to ASME Y 14.5 M - 1994.
2 Dimension is measured at the maximum solder ball diameter, parallel to primary datum C .
3 Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
4. Maximum mold to substrate offset shall be 0.127.
5. The surface finish of the package shall be EDM charmille #18 - #21.
6. Unless otherwise specified tolerance: Decimal ±0.05; Angular ±2
DS451PP3
25
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