DESCRIPTION
The H21B4, H21B5 and H21B6 consist of a gallium arsenide infrared emitting diode coupled with a silicon photodarlington in a plastic housing. The packaging system is designed to optimize the mechanical resolution, coupling efficiency, ambient light rejec tion, cost and reliability. The gap in the housing provides a means of interrupting the signal with an opaque material, switching the output from an “ON” to an “OFF” state.

FEATURES
• Opaque housing
• Low cost
• 035" apertures
• High IC(ON)