STM32F031E4Y6TR(2015) Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
fabricante
STM32F031E4Y6TR
(Rev.:2015)
(Rev.:2015)
STMicroelectronics
STM32F031E4Y6TR Datasheet PDF : 106 Pages
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Package information
STM32F031x4 STM32F031x6
7.6
TSSOP20 package information
TSSOP20 is a 20-lead thin shrink small-outline, 6.5 x 4.4 mm, 0.65 mm pitch, package.
Figure 46.TSSOP20 package outline
ϮϬ
ϭ
W/Eϭ
/ Ed/&/d/KE
ĂĂĂ
ď
ϭϭ
ϭ
^ d/E'
W>E
ϭϬ
ϭ
Ϯ
Ğ
Đ
Ϭ͘Ϯϱŵŵ
'h' W>E
Ŭ
>
>ϭ
1. Drawing is not to scale.
Symbol
Table 67. TSSOP20 package mechanical data
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
A
A1
A2
b
c
D(2)
E
E1(3)
e
L
L1
-
0.050
0.800
0.190
0.090
6.400
6.200
4.300
-
0.450
-
-
-
1.000
-
-
6.500
6.400
4.400
0.650
0.600
1.000
1.200
0.150
1.050
0.300
0.200
6.600
6.600
4.500
-
0.750
-
-
0.0020
0.0315
0.0075
0.0035
0.2520
0.2441
0.1693
-
0.0177
-
-
-
0.0394
-
-
0.2559
0.2520
0.1732
0.0256
0.0236
0.0394
zͺD ͺsϯ
Max.
0.0472
0.0059
0.0413
0.0118
0.0079
0.2598
0.2598
0.1772
-
0.0295
-
96/106
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