Shanghai Leiditech Electronic Technology Co., Ltd
Test condition
Varistor voltage In = 1 mA DC
Leakage current Vdc = 18 V DC
Maximum clamping voltage Ic = 1 A
Rated peak single pulse transient current 8 / 20 ㎲ waveform, +/- each 1 time induce
Capacitance 10/1000 ㎲ waveform
Insulation resistance after reflow soldering f = 1MHz, Vrms = 0.5 V
Soldering paste : Tamura (Japan) RMA-20-21L
Reflow soldering condition
Stencil : SUS, 120 ㎛ thickness Pad size : 0.8 (Width) x 0.9 (Length)
0.8 (Distance between pads)
Soldering profile : 260±5 ℃, 5 sec.