Plastic Ball Grid Array (PBGA):

Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while maximizing the performance characteristics of semiconductors. Amkor’s PBGAs are designed for low inductance, improved thermal operation and enhanced SMT ability. Custom performance enhancements, like ground and power planes, are available for significant improvements in electrical response demanded by advancing electronics. Additionally, these PBGAs utilize industry proven, semiconductor grade materials for reliable, longterm operations while providing the user flexible design parameters.

APPLICATIONs:
   Semiconductor technologies find enhanced performance by using the integrated design features of Amkor’s PBGAs. Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets find Amkor’s PBGA family to be an ideal package. Applications requiring improved portability, form-factor/size and high-performance such as cellular, wireless telecommunications, PCMCIA cards, global positioning systems (GPS), laptop PCs, video cameras, disc drives, PLDs, graphics and other similar products benefit from Amkors PBGA attributes.