NSB8STHE3_B/P Datasheet - Vishay Semiconductors

FEATURES
• Power pack
• Glass passivated pellet chip junction
• Low forward voltage drop
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
• Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AC and ITO-220AC package)
• AEC-Q101 qualified available
    - Automotive ordering code: base P/NHE3 (for ITO-220AC and TO-263AB package)
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS
    For use in general purpose rectification of power supplies, inverters, converters and freewheeling diodes application.