STM32WB55xx STM32WB35xx
Package information
7.2
F
10
G
A
WLCSP100 package information
WLCSP100 is a 100-ball, 4.390 x 4.371 mm, 0.4 mm pitch, wafer level chip scale package.
Figure 41. WLCSP100 outline
e1
A1 BALL LOCATION
A1
1
e4
e2 E
e
DETAIL A
E
K
e
e3
D
BOTTOM VIEW
A3
K
H
A2
D
TOP VIEW
BUMP
A
A2
SIDE VIEW
FRONT VIEW
A1
DETAIL A
ROTATED 90
SEATING PLANE
A08S_WLCSP100_ME_V1
DS11929 Rev 10
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185