STM32WB55RGU7TR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
STM32WB55RGU7TR
STMicroelectronics
STM32WB55RGU7TR Datasheet PDF : 193 Pages
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STM32WB55xx STM32WB35xx
Package information
Symbol
Table 100. UFBGA129 mechanical data (continued)
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
D
E
D1
E1
e
F
ddd
eee(4)
fff(5)
6.85
6.85
-
-
-
-
-
-
-
7.00
7.00
6.00
6.00
0.50
0.50
-
-
-
7.15
0.270
0.276
0.281
7.15
0.270
0.276
0.281
-
-
0.236
-
-
-
0.236
-
-
-
0.020
-
-
-
0.020
-
0.08
-
-
0.003
0.15
-
-
0.006
0.05
-
-
0.002
1. Values in inches are converted from mm and rounded to four decimal digits.
2. - UFBGA stands for Ultra Thin Profile Fine Pitch Ball Grid Array.
- Ultra thin profile: 0.50 < A ≤ 0.65mm / Fine pitch: e < 1.00mm pitch.
- The total profile height (Dim A) is measured from the seating plane to the top of the component
- The maximum total package height is calculated by the following methodology:
A Max = A1 Typ + A2 Typ + A4 Typ + √ (A1²+A2²+A4² tolerance values).
3. The typical balls diameters before mounting is 0.20 mm.
4. The tolerance of position that controls the location of the pattern of balls with respect to datum A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datum A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
5. The tolerance of position that controls the location of the balls within the matrix with respect to each other.
For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position
as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each
tolerance zone fff in the array is contained entirely in the respective zone eee above The axis of each ball
must lie simultaneously in both tolerance zones.
Figure 39. UFBGA129 recommended footprint
Dpad
Dsm
DS11929 Rev 10
BGA_WLCSP_FT_V1
171/193
185
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