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ST62T01LN6 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
ST62T01LN6 Datasheet PDF : 100 Pages
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ST6200C/ST6201C/ST6203C
12.2 THERMAL CHARACTERISTICS
Symbol
RthJA
PD
TJmax
Ratings
Package thermal resistance (junction to ambient)
DIP16
SO16
SSOP16
Power dissipation 1)
Maximum junction temperature 2)
Value
90
90
125
500
150
Unit
°C/W
mW
°C
Notes:
1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
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