STM32F031E6P6TR(2015) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
STM32F031E6P6TR
(Rev.:2015)
(Rev.:2015)
STMicroelectronics
STM32F031E6P6TR Datasheet PDF : 106 Pages
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STM32F031x4 STM32F031x6
Package information
Figure 37. UFQFPN32 package outline
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device
ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.
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