STM32F301x6 STM32F301x8
Electrical characteristics
/6%,'($/
9''$
(2
Figure 31. ADC accuracy characteristics
(*
(7
(/
('
/ 6%,'($/
([DPSOHRIDQDFWXDOWUDQVIHUFXUYH
7KHLGHDOWUDQVIHUFXUYH
(QGSRLQWFRUUHODWLRQOLQH
E(H7WZ7HRHWDQOWK8HQDDFGWMXXDVOWHDGQG(WUKUHRULG HPDDO[WULDPQXVPIHUGFHXYULYDHWVLRQ
(2 2IIVHW(UURUGHYLDWLRQEHWZHHQWKHILUVWDFWXDO
WUDQVLWLRQDQGWKHILUVWLGHDORQH
(* *DLQ (UURU GHYLDWLRQ EHWZHHQ WKH ODVW LGHDO
WUDQVLWLRQDQGWKHODVWDFWXDORQH
(EH'WZ'HLHIIQHUDHFQWWXLDDOO/VLWQHHSDVULDW\QG(UWUKRHULGPHDD[OLRPQXHP GHYLDWLRQ
(/ ,QWHJUDO /LQHDULW\ (UURU PD[LPXP GHYLDWLRQ
EHWZHHQ DQ\ DFWXDO WUDQVLWLRQ DQG WKH HQG SRLQW
FRUUHODWLRQOLQH
966$
9''$
069
Figure 32. Typical connection diagram using the ADC
5$,1
$,1[
9 $,1
&SDU DVLWLF
9 ''
97
9
97
9
,/ $
4BNQMFBOEIPME"%$
DPOWFSUFS
5 $'&
CJU
DPOWFSUFS
&$'&
069
1. Refer to Table 63 for the values of RAIN.
2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 11. The 10 nF capacitor
should be ceramic (good quality) and it should be placed as close as possible to the chip.
DocID025146 Rev 3
105/132
112