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STM32L151VBH6TR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
STM32L151VBH6TR Datasheet PDF : 133 Pages
First Prev 131 132 133
STM32L151x6/8/B STM32L152x6/8/B
Revision history
Date
12-Nov-2013
22-Jul-2014
Table 73. Document revision history (continued)
Revision
Changes
Updated Table 54: ADC characteristics and Figure 27: Typical
connection diagram using the ADC.
Table 58: Temperature sensor calibration values was previously in
Section 3.10.1: Temperature sensor. Updated Table 59:
Temperature sensor characteristics.
In Table 61: Comparator 2 characteristics, parameter dThreshold/dt,
replaced any occurrence of “VREF+” by “VREFINT”Updated
Table 63: LQPF100 14 x 14 mm, 100-pin low-profile quad flat
package mechanical data, Table 64: LQFP64 10 x 10 mm 64-pin
low-profile quad flat package mechanical data, Table 65: LQFP48 7
x 7 mm, 48-pin low-profile quad flat package mechanical data and
Table 66: UFQFPN48 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch
9
quad flat no-lead package mechanical data.
(continued) Updated Figure 33: LQFP100 recommended footprint.
Updated Figure 46: TFBGA64 - 5.0x5.0x1.2 mm, 0.5 mm pitch, thin
fine-pitch ball grid array package outline title.
Remove minimum and typical values of A dimension in Table 67:
UFBGA100 7 x 7 x 0.6 mm 0.5 mm pitch, ultra thin fine-pitch ball
grid array package mechanical data
Deleted second footnote in Figure 42: UFQFPN48 recommended
footprint.
Updated Section 8: Ordering information title and added first
sentence.
Changed BOR disabled option identifier in Table 72: Ordering
information scheme.
Updated Figure 14, Figure 15.
Updated Table 5.
10
Updated Figure 6.3.4.
Updated note 5 inside Table 54.
Updated Ro value inside Table 54.
DocID17659 Rev 12
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