13.5 16-Pin SOIC 300-mil
FM25Q32
SYMBOL
A
A1
b
C
D(3)
E
E1(3)
e(2)
L
θ
y
MILLIMETERS
MIN
MAX
2.36
2.64
0.10
0.30
0.33
0.51
0.18
0.28
10.08
10.49
10.01
10.64
7.39
7.59
1.27BSC
0.39
1.27
0˚
8˚
---
0.076
INCHES
MIN
MAX
0.093
0.104
0.005
0.012
0.013
0.020
0.007
0.000
0.397
0.413
0.394
0.419
0.291
0.299
0.050
0.015
0.050
0˚
8˚
---
0.003
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the
bottom of the package.
preliminary(Aug.18.2010) 60