STM32L151xC STM32L152xC
Package information
Figure 49. Thermal resistance suffix 6
7.7.1
3'P:
&ŽƌďŝĚĚĞŶĂƌĞĂ
d:хd:ŵĂdž
ϱϬϬ͘ϬϬ
Ϭ͘ϬϬ
Ϭ
7HPSHUDWXUH&
:/&63
/4)3[PP
8)%*$[PP
/4)3[PP
8)4)31[PP
/4)3[PP
Figure 50. Thermal resistance suffix 7
D^ϯϭϰϬϱsϱ
3'P:
)RUELGGHQDUHD
7-!7-PD[
:/&63
/4)3[PP
8)%*$[PP
/4)3[PP
8)4)31[PP
/4)3[PP
7HPSHUDWXUH&
06Y9
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
DocID022799 Rev 13
129/136
135