STM32F091VB View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM32F091VB

ARM®-based 32-bit MCU, up to 256 KB Flash, CAN, 12 timers, ADC, DAC, and comm. interfaces, 2.0 - 3.6V

STMicroelectronics 

STM32F091xB STM32F091xC

9

Revision history

Revision history

Date

30-Oct-2014

09-Feb-2015

17-Dec-2015

Table 82. Document revision history

Revision

Changes

1

Initial release.

Updated:

– Table: HSI oscillator characteristics,

– Figure : HSI oscillator accuracy characterization

results for soldered parts,

– Figure: WLCSP64 wafer level chip size package

2

mechanical drawing,

– Table: WLCSP64 - 64-pin, 3.347 x 3.585 mm, 0.4 mm

pitch wafer level chip scale package mechanical data,.

Added:

– Figure: WLCSP64 - 64-pin, 3.347 x 3.585 mm,

0.4 mm pitch wafer level chip scale recommended

footprint.

Section 2: Description:

– Table 2: STM32F091xB/xC family device features and

peripheral counts- I/O and capacitive channel

numbers corrected

Section 3: Functional overview:

– updated Figure 1: Block diagram (number of AF) and

Figure 2: Clock tree

– Section 3.5.4: Low-power modes - added info. on

comm. peripherals configurable to operate with HSI

– Section 3.13: Touch sensing controller (TSC) -

number of channels corrected

– added number of complementary outputs for the

general purpose and for the advance control timers in

3

Table 7: Timer feature comparison

– Table 9: STM32F091xB/xC I2C implementation -

added 20mA value to Fast Mode Plus output drive

Section 4: Pinouts and pin descriptions:

– Package pinout figures updated (look and feel)

– Figure 7: WLCSP64 package pinout - now presented

in top view

– Table 13: STM32F091xB/xC pin definitions - MCO

moved from additional to alternate functions column

– Table 19: Alternate functions selected through

GPIOF_AFR registers for port F- lines PF4 and PF5

removed

– Section 5: Memory mapping:

– added information on STM32F091xB difference

versus STM32F091xC map in Figure 10

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