
Vorläufige Daten / Preliminary Data
Empfohlenes Lötpaddesign
Recommended Solderpad Design
Bauteil positioniert
Component location on pad
SFH 4650, SFH 4655
1.7
Paddesign for improved
heat dissipation
2
Cu-area
Bauteil positioniert
Component location on pad
Solder resist
OHF02421
2005-03-08
2.4
Paddesign for improved
heat dissipation
2
Cu-area
Solder resist
OHF02422
7