STM32F100VB View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM32F100VB

Low & medium-density value line, advanced ARM®-based 32-bit MCU with 16 to 128 KB Flash, 12 timers, ADC, DAC & 8 comm interfaces

STMicroelectronics 

Package information

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

Table 50. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball

grid array package mechanical data

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

E1

-

3.500

-

-

0.1378

-

e

-

0.500

-

-

0.0197

-

F

-

0.750

-

-

0.0295

-

ddd

-

-

0.080

-

-

0.0031

eee

-

-

0.150

-

-

0.0059

fff

-

-

0.050

-

-

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 44. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball

grid array, recommended footprint

'SDG

'VP

5B)3B9

Table 51. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA)

Dimension

Recommended values

Pitch

0.5

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.280 mm

Stencil thickness

Between 0.100 mm and 1.125 mm

Pad trace width

0.100 mm

84/96

DocID16455 Rev 9

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