STM32F100VBH6BTR(2010) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM32F100VBH6BTR
(Rev.:2010)

Low & medium-density value line, advanced ARM-based 32-bit MCU with 16 to 128 KB Flash, 12 timers, ADC, DAC & 8 comm interfaces

STMicroelectronics 

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

Package characteristics

6.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 8: General operating conditions on page 34.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x JA)

Where:

● TA max is the maximum ambient temperature in C,

● JA is the package junction-to-ambient thermal resistance, in C/W,

● PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

● PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 51. Package thermal characteristics

Symbol

Parameter

Thermal resistance junction-ambient

LQFP 100 - 14 × 14 mm / 0.5 mm pitch

Thermal resistance junction-ambient

LQFP 64 - 10 × 10 mm / 0.5 mm pitch

JA

Thermal resistance junction-ambient

TFBGA64 - 5 × 5 mm / 0.5 mm pitch

Thermal resistance junction-ambient

LQFP 48 - 7 × 7 mm / 0.5 mm pitch

Value

46

45

65

55

Unit

°C/W

6.2.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org.

Doc ID 16455 Rev 2

79/84

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