STM32F100VB(2010) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM32F100VB
(Rev.:2010)

Low & medium-density value line, advanced ARM-based 32-bit MCU with 16 to 128 KB Flash, 12 timers, ADC, DAC & 8 comm interfaces

STMicroelectronics 

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

Electrical characteristics

5.3.2

Table 8. General operating conditions (continued)

Symbol

Parameter

Conditions

Min Max Unit

VBAT Backup operating voltage

Power dissipation at TA =

PD

85 °C for suffix 6 or TA =

105 °C for suffix 7(2)

LQFP100

LQFP64

TFBGA64

LQFP48

1.8 3.6

V

434

444

mW

308

363

Ambient temperature for 6

suffix version

Maximum power dissipation –40 85

Low power dissipation(3)

–40 105

°C

TA

Ambient temperature for 7

suffix version

Maximum power dissipation –40 105

Low power dissipation(3)

–40 125

°C

6 suffix version

TJ

Junction temperature range

7 suffix version

–40 105

°C

–40 125

1. When the ADC is used, refer to Table 41: ADC characteristics.

2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal

characteristics on page 79).

3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Table 6.2: Thermal characteristics on page 79).

Operating conditions at power-up / power-down

Subject to general operating conditions for TA.

Table 9. Operating conditions at power-up / power-down

Symbol

Parameter

Min

Max

Unit

tVDD

VDD rise time rate

VDD fall time rate

0



µs/V

20



5.3.3

Embedded reset and power control block characteristics

The parameters given in Table 10 are derived from tests performed under the ambient

temperature and VDD supply voltage conditions summarized in Table 8.

Doc ID 16455 Rev 2

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