datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

ACS8515REV2.1 View Datasheet(PDF) - Semtech Corporation

Part Name
Description
MFG CO.
ACS8515REV2.1 Datasheet PDF : 50 Pages
First Prev 41 42 43 44 45 46 47 48 49 50
ADVANCED COMMUNICATIONS
Package Information
Figure 16. LQFP Package
ACS8515 Rev2.1 LC/P
FINAL
D2
D1 1 3
AN2
E E1
2
1
3
4
123
A A2
Seating plane
A1 6
A
A
5
e
b
1
AN1
R1
S
B
L
L1
b7
c
7
b1 7
Notes
1 The top package body may be smaller than the bottom package body by as much as 0.15 mm.
2 To be determined at seating plane.
3 Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side.
D1 and E1 are maximum plastic body size dimensions including mold mismatch.
4 Details of pin 1 identifier are optional but will be located within the zone indicated.
5 Exact shape of corners can vary.
6 A1 is defined as the distance from the seating plane to the lowest point of the package body.
7 These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead
8 Shows plating.
Revision 2.01/December 2005 Semtech Corp.
46
www.semtech.com

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]