Package characteristics
STM8S105xx
Symbol
ΘJA
ΘJA
Parameter
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
Thermal resistance junction-ambient
VQFPN 32 - 5 x 5 mm
Value
60
22
Unit
°C/W
°C/W
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
convection environment.
11.3.1
11.3.2
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural convection
(still air). Available from www.jedec.org.
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the order code.
The following example shows how to calculate the temperature range needed for a given
application.
Assuming the following application conditions:
• Maximum ambient temperature TAmaz = 82 °C (measured according to JESD51-2)
• IDDmax = 15 mA, VDD = 5.5 V
• Maximum 8 standard I/Os used at the same time in output at low level with IOL = 10 mA,
VOL= 2 V
• Maximum 4 high sink I/Os used at the same time in output at low level with IOL = 20 mA,
VOL= 1.5 V
• Maximum 2 true open drain I/Os used at the same time in output at low level with IOL =
20 mA, VOL= 2 V
PINTmax = 15 mA x 5.5 V = 82.5 mW
PIOmax = (10 mA x 2 V x 8 )+(20 mA x 2 V x 2)+(20 mA x 1.5 V x 4) = 360 mW
This gives: PINTmax = 82.5 mW and PIOmax 360 mW:
PDmax = 82.5 mW + 360 mW
Thus: PDmax = 443 mW
TJmax for LQFP32 can be calculated as follows, using the thermal resistance ΘJA :
TJmax = 75° C + (59° C/W x 464 mW) = 75°C + 27°C = 102° C
This is within the range of the suffix 6 version parts (-40 < TJ < 106° C). In this case, parts
must be ordered at least with the temperature range suffix 6.
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