IO2-098P(720) View Datasheet(PDF) - Amphenol Aerospace
Part Name
Description
MFG CO.
IO2-098P(720) Datasheet PDF : 44 Pages
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Other Brush Contact Rectangular Connectors
HSB3 High Density Series with
3.125 Gb/s High Speed data rate
HSB3 CONNECTORS
The HSB3 is a further new development of the higher density HDB3
connector series. The HSB3 offers higher speed as well as higher
density. Benefits include:
• Allows data rates up to 3.125 Gb/s via 100 ohm matched
impedance differential pairs
• Uses partially populated HDB3 mother board and daughter
board inserts. See HSB3 arrangements below.
For more information refer to Amphenol® brochure SL-402, on-line
at www.amphenol-aerospace.com. or call 800-678-0141 and ask
for Amphenol board level product marketing for assistance.
HSB3 Insert Arrangements
5
6
4
123 1
E
F
D
ABC
HSB3 HIGH DENSITY/HIGH SPEED BRUSH CONNECTOR
As viewed from front face of Daughter Board Connector
5
6
4
123 1
E
F
D
ABC
40 Pin Body with 3 Differential Pair, 20 Signal Contacts
5
6
4
1
3
2
1
60 Pin Body with 5 Differential Pair, 30 Signal Contacts
E
F
D
A
C
B
5
6
4
1 23 1
80 Pin Body with 7 Differential Pair, 40 Signal Contacts
E
F
D
A BC
5
6
4
123 1
120 Pin Body with 10 Differential Pair, 60 Signal Contacts
E
F
D
AB C
160 Pin Body with 13 Differential Pair, 80 Signal Contacts
KEY
100 Ohm Differential Pair Contacts
(100 Ohm Differential contact pairs capable of 3.125 Gb/s data rates)
Empty Contact Cavity
Standard Digital, Low Speed Signal Contacts
36
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