Revision history
M25P10-A
Table 24. Document revision history
Date
Revision
Changes
14-Apr-2006
05-Jun-2006
All packages are ECOPACK® compliant. Grade 3 information added (see
Table 10, Table 11, Table 15, Table 17, Table 18 and Table 23).
Figure 3: Bus Master and memory devices on the SPI Bus modified and
Note 2 added.
Table 11: Data retention and endurance added.
40MHz frequency condition modified for ICC3 in Table 14: DC
6
Characteristics (Device Grade 6).
Table 14: DC Characteristics (Device Grade 6) shows preliminary data.
MLP package renamed as VFQFPN and specifications updated (see
silhouette on page 1, Figure 27 and Table 22). Note 2 added below
Figure 26 and Note 2 added below Figure 27. VWI parameter for Device
Grade 3 added to Table 8: Power-Up Timing and VWI Threshold.
/X Process added to Table 23: Ordering information scheme.
tRES1 and tRES2 parameter timings changed for devices produced with the
“X” process technology in Table 18 and Table 19.
7
SO8 Narrow package specifications updated (see Figure 26 and
Table 21).
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