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SC2516MLTR View Datasheet(PDF) - Semtech Corporation

Part Name
Description
MFG CO.
SC2516MLTR Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
SC2516
POWER MANAGEMENT
Pin Descriptions
Pin # Pin Name
Pin Function
1
COMP Compensation pin for the PWM transconductance amplifier for the VDDQ Switcher.
2
FBVDDQ Feedback for the VDDQ regulator. Connect to the VDDQ sense at the point of load.
3
SS/EN Soft start capacitor to GND. Pull low to disable controller.
4
VTTGND VTT return. Connect to copper plane carrying VTT return current. The trace connecting to this pin
must be able to carry 2 Amps.
5
VTT
VTT Regulator output. Regulates to 1/2 VDDQ. Sources or sinks 1.8 Amps. The trace connecting
to this pin must be able to carry 2 Amps.
6
VDDQ VDDQ power input to VTT LDO. The trace connecting to this pin must be able to carry 2 Amps.
7
AGND Analog ground. Compensation components and the Soft Start Capacitor connect to this ground.
8
VTTFB Sense input for the VTT regulator. Connect to Point of Load for the VTT rail.
9
REFSNS Sense input for the VDDQ rail. VTT will be regulated to 1/2 of its voltage. Connect to Point of
Load, where the VREF for the memory is generated.
10 FB_GMCH Sense input for the GMCH. Connect to Point of Load for the GMCH rail.
11 SS_GMCH Soft start for GMCH switcher . Connect a capacitor to GND.
12
POK
Connect to power OK signal from ATX power.
13 GND_GMCH Gate Drive return Ground for the GMCH regulator. Connect to Source of bottom FET.
14 BG_GMCH Bottom FET Gate drive for the GMCH regulator.
15 TG_GMCH Top FET Gate drive for the GMCH regulator.
16
BF_CUT Latched BF_CUT input from Glue Chip.
17 COMP_GMCH Compensation pin for the PWM transconductance amplifier for the GMCH Switcher
18
5VSBY Connect to 5VSTBY input.
19
BST
The Top and Bottom Gate drive bus.Generated using bootstrap diode/capacitor. An additional
diode is also required to trap the peak Bootstrap voltage for the BG drive. (see typical
application circuit)
20
TG
Top FET gate drive.
21
BG
Bottom FET gate drive.
22
PGND Gate drive return. Keep this pin close to bottom FET source.
23
TH_PAD Copper pad on bottom of chip used for heatsinking. It must be connected to ground plane under
IC.
© 2005 Semtech Corp.
5
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