SST89E564-40-C-PI View Datasheet(PDF) - Silicon Storage Technology
Part Name
Description
MFG CO.
SST89E564-40-C-PI Datasheet PDF : 58 Pages
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FlashFlex51 MCU
SST89E564 / SST89V564 / SST89E554 / SST89V554
Preliminary Specifications
10.0 ELECTRICAL SPECIFICATION
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to + 150°C
Voltage on EA# Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
Transient Voltage (<20ns) on Any Other Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +6.5V
Maximum IOL per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Maximum IOL per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.
Note: This specification contains preliminary information on new products in production.
The specifications are subject to change without notice.
10.1 Operation Range
TABLE 10-1: OPERATING RANGE
Symbol
Ta
VDD
fOSC
Description
Ambient Temperature Under Bias
Standard
Industrial
Supply Voltage
Oscillator Frequency
For In-Application Programming
Min.
0
-40
2.7
0
0.25
Max
+70
+85
5.5
40
40
Unit
°C
°C
V
MHz
MHz
T10-1.1 384
10.2 Reliability Characteristics
TABLE 10-2: RELIABILITY CHARACTERISTICS
Symbol
Parameter
Minimum Specification Units Test Method
NEND1
Endurance
10,000
Cycles JEDEC Standard A117
TDR1
ILTH1
Data Retention
Latch Up
100
100 + IDD
Years JEDEC Standard A103
mA JEDEC Standard 78
T10-2.0 384
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
©2001 Silicon Storage Technology, Inc.
47
S71181-03-000 9/01 384
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