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PIC16LC62XT-04/SS View Datasheet(PDF) - Microchip Technology

Part Name
Description
MFG CO.
PIC16LC62XT-04/SS
Microchip
Microchip Technology 
PIC16LC62XT-04/SS Datasheet PDF : 112 Pages
First Prev 91 92 93 94 95 96 97 98 99 100 Next Last
PIC16C62X(A)
14.5 Package Marking Information
18-Lead PDIP
XXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXX
AABBCDE
Example
PIC16C622A
-04I / P456
9523 CBA
18-Lead SOIC (.300")
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCDE
Example
PIC16C622
-04I / S0218
9518 CDK
18-Lead CERDIP Windowed
XXXXXXXX
XXXXXXXX
AABBCDE
20-Lead SSOP
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
Example
16C622
/JW
9501 CBA
Example
PIC16C622A
-04I / 218
9551 CBP
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA
Year code (last 2 digits of calendar year)
BB
Week code (week of January 1 is week ‘01’)
C
Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.
D
Mask revision number
E
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
DS30235F-page 100
Preliminary
© 1997 Microchip Technology Inc.

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