STM32F030C8P6TR(2013) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STM32F030C8P6TR
(Rev.:2013)

Value-line ARM®-based 32-bit MCU with up to 256-KB Flash, timers, ADC, communication interfaces, 2.4-3.6 V operation

STMicroelectronics 

Electrical characteristics

STM32F030x4 STM32F030x6 STM32F030x8

4095

4094

4093

7

6

5

4

3

2

1

Figure 20. ADC accuracy characteristics

1 LSBIDEAL



VDDA

4096

EG

(1) Example of an actual transfer curve

(2) The ideal transfer curve

(3) End point correlation line

(2)

ET

(3)

(1)

ET=Total Unadjusted Error: maximum deviation

between the actual and the ideal transfer curves.

EO=Offset Error: deviation between the first actual

transition and the first ideal one.

EO

EL

EG=Gain Error: deviation between the last ideal

transition and the last actual one.

ED=Differential Linearity Error: maximum deviation

between actual steps and the ideal one.

ED

EL=Integral Linearity Error: maximum deviation

between any actual transition and the end point

correlation line.

1 LSBIDEAL

0

1 2345 67

VSSA

4093 4094 4095 4096

VDDA

MS19880V1

Figure 21. Typical connection diagram using the ADC

RAIN(1)

AINx

VAIN

Cparasitic

VDDA

VT

0.6 V

VT

0.6 V

IL±1 μA

Sample and hold ADC

converter

RADC

12-bit

converter

CADC

MS19881V2

1. Refer to Table 48: ADC characteristics for the values of RAIN, RADC and CADC.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy

this, fADC should be reduced.

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 10: Power supply

scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as

close as possible to the chip.

66/88

DocID024849 Rev 1

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