Electrical characteristics
STM32F030x4 STM32F030x6 STM32F030x8
Table 21. Embedded internal reference voltage (continued)
Symbol
Parameter
Conditions
Min Typ Max Unit
VREFINT
Internal reference voltage
spread over the temperature
range
VDDA = 3 V ±10 mV
-
- 10(3)
mV
TCoeff
Temperature coefficient
- - 100(3) ppm/°C
1. Data based on characterization results, not tested in production.
2. Shortest sampling time can be determined in the application by multiple iterations.
3. Guaranteed by design, not tested in production.
6.3.5
Supply current characteristics
The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in Figure 11: Current consumption
measurement scheme.
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to CoreMark code.
Typical and maximum current consumption
The MCU is placed under the following conditions:
All I/O pins are in input mode with a static value at VDD or VSS (no load)
All peripherals are disabled except when explicitly mentioned
The Flash memory access time is adjusted to the fHCLK frequency (0 wait state from 0
to 24 MHz and 1 wait state above 24 MHz)
Prefetch is ON when the peripherals are enabled, otherwise it is OFF (to enable
prefetch the PRFTBE bit in the FLASH_ACR register must be set before clock setting
and bus prescaling)
When the peripherals are enabled fPCLK = fHCLK
The parameters given in Table 22 to are derived from tests performed under ambient
temperature and supply voltage conditions summarized in Table 18: General operating
conditions.
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