ST72F324J2B5 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

ST72F324J2B5

8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, 4 TIMERS, SPI, SCI INTERFACE

STMicroelectronics 

ST72324

13.2 THERMAL CHARACTERISTICS

Symbol

RthJA

PD

TJmax

Ratings

Package thermal resistance (junction to ambient)

TQFP44 10x10

TQFP32 7x7

SDIP42 600mil

SDIP32 200mil

Power dissipation 1)

Maximum junction temperature 2)

Value

52

70

55

50

500

150

Unit

°C/W

mW

°C

Notes:

1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)

and PPORT is the port power dissipation determined by the user.

2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

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