4 Mbit Flash + 1 Mbit or 256 Kbit SRAM ComboMemory
SST31LF041 / SST31LF041A / SST31LF043 / SST31LF043A
Data Sheet
PACKAGING DIAGRAMS
Pin # 1 Identifier
1.05
0.95
.50
BSC
8.10
.270
.170
7.90
12.50
12.30
0.15
0.05
0.70
0.50
14.20
13.80
32.TSOP-WH-ILL.4
Note:
1. Complies with JEDEC publication 95 MO-142 BA dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±.05) mm.
4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
©2001 Silicon Storage Technology, Inc.
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S71107-03-000 5/01 349