PACKAGING DIAGRAMS
1 Megabit Page Mode EEPROM
SST29EE010A / SST29LE010A / SST29VE010A
pin 1 index
1
CL
32
.065
1.645
.075
1.655
7˚
4 PLCS.
Base Plane
Seating Plane
.015
.050
.070
.045
.080
.065
.170
.200
.008
.120
.012
.150
.016
.100 BSC
.022
Note:
1. Complies with JEDEC publication 95 MO-015 AP dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .010 inches.
32-LEAD PLASTIC DUAL-IN-LINE PACKAGE (PDIP)
SST PACKAGE CODE: PH
.600
.625
.530
.550
0˚
15˚
.600 BSC
32.pdipPH-ILL.1
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Optional Pin #1
Identifier .042
.048
.485
.495
.447
.453
2 1 32
.020 R.
MAX.
.106
.112
.023 x 30˚
.029
.030
.040
R.
.042
.048
.585 .547
.595 .553
.013
.021
.026
.400 .490
.032
BSC .530
.050
BSC.
.050
BSC.
.015 Min.
.075
.095
.026
.125
.032
.140
Note:
1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
© 1999 Silicon Storage Technology, Inc.
24
32.PLCC.NH-ILL.1
303-01 2/99