SI5324C-C-GM View Datasheet(PDF) - Silicon Laboratories
Part Name
Description
MFG CO.
SI5324C-C-GM Datasheet PDF : 72 Pages
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Si5324
Table 16. PCB Land Pattern Dimensions
Dimension
e
E
D
E2
D2
GE
GD
X
Y
ZE
ZD
MIN
0.50 BSC.
5.42 REF.
5.42 REF.
4.00
4.00
4.53
4.53
—
0.89 REF.
—
—
MAX
4.20
4.20
—
—
0.28
6.31
6.31
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
Stencil Design
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
9. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the
center ground pad.
Card Assembly
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
Small Body Components.
Rev. 1.1
69
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