SC2545
POWER MANAGEMENT
Applications Information (Cont.)
Sometimes meeting tight input voltage ripple
specifications may require the use of larger input
capacitance. At full load, the peak-to-peak input voltage
ripple due to the ESR is
'Y (65
5 HVU
G
,R
The peak-to-peak input voltage ripple due to the capacitor
is
'Y &
|
',R
&LQIV
From these two expressions, CIN can be found to meet
the input voltage ripple specification. In a multi-phase
converter, channel interleaving can be used to reduce
ripple. The two step-down channels of the SC2545
operate at 180 degrees from each other. If both step-
down channels in the SC2545 are connected to the same
input rail, the input RMS currents will be reduced. Ripple
cancellation effect of interleaving allows the use of
smaller input capacitors.
When two channels with a common input are interleaved,
the total DC input current is simply the sum of the
individual DC input currents. The combined input current
waveform depends on duty ratio and the output current
waveform. Assuming that the output current ripple is
small, the following formula can be used to estimate the
RMS value of the ripple current in the input capacitor.
Let the duty ratio and output current of Channel 1 and
Channel 2 be D1, D2 and Io1, Io2, respectively.
If D1<0.5 and D2<0.5, then
,&LQ | ',R ',R
If D1>0.5 and (D1-0.5) < D2<0.5, then
,&LQ | ,R ' ,R ,R ' ' ,R
Choosing Power MOSFETs
Main considerations in selecting the MOSFETs are power
dissipation, MOSFETs cost, and packaging. Switching
losses and conduction losses of the MOSFETs are
directly related to the total gate charge (Cg) and channel
on-resistance (Rds(on)). In order to judge the performance
of MOSFETs, the product of the total gate charge and
on-resistance is used as a figure of merit (FOM).
Transistors with the same FOM follow the same curve in
Figure 8.
$
BhrÃ8uh
trÃ8 888ttt
!
$
Sq
Sq
Sq
#
!
$
$
!
Sq
!
P
rvhprÃPu
)20A^`
)20A^`
)20A^`
Figure 8. Figure of Merit curves.
The closer the curve is to the origin, the lower is the FOM.
This means lower switching loss or lower conduction loss
or both. It may be difficult to find MOSFETs with both
low Cg and low Rds(on. Usually a trade-off between Rds(on
and Cg has to be made.
MOSFET selection also depends on applications. In many
applications, either switching loss or conduction loss
dominates for a particular MOSFET. For synchronous buck
converters with high input to output voltage ratios, the
top MOSFET is hard switched but conducts with very low
duty cycle. The bottom switch conducts at high duty cycle
but switches at near zero voltage. For such applications,
MOSFETs with low Cg are used for the top switch and
MOSFETs with low Rds(on) are used for the bottom switch.
If D1>0.5 and D2 < (D1-0.5) < 0.5, then
,&LQ | ,R ' ,R ,R ' ' ,R
If D1>0.5 and D2 > 0.5, then
,&LQ | ' ' ,R ,R ' ,R ',R
MOSFET power dissipation consists of
a) conduction loss due to the channel resistance Rds(on);
b) switching loss due to the switch rise time tr and fall
time tf; and
c) the gate loss due to the gate resistance RG.
ã 2005 Semtech Corp.
13
www.semtech.com