ST72521M/R/AR
13.2 THERMAL CHARACTERISTICS
Symbol
RthJA
Ratings
Package thermal resistance (junction to ambient)
TQFP80 14x14
TQFP64 14x14
TQFP64 10x10
Value
55
47
50
Unit
°C/W
PD
TJmax
Power dissipation 1)
Maximum junction temperature 2)
500
mW
150
°C
Notes:
1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)
and PPORT is the port power dissipation determined by the user.
2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.
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