NXP Semiconductors
PCA8538
Automotive 102 x 9 Chip-On-Glass LCD segment driver
27. Figures
Fig 1. Block diagram of PCA8538 . . . . . . . . . . . . . . . . . .4
Fig 2. Pinning diagram of PCA8538UG . . . . . . . . . . . . . .5
Fig 3. Recommended start-up sequence when using the
internal charge pump and the internal clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Fig 4. Recommended start-up sequence when using an
external supplied VLCD and the internal clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Fig 5. Recommended start-up sequence when using the
internal charge pump and an external clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Fig 6. Recommended start-up sequence when using an
external supplied VLCD and an external clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Fig 7. Recommended power-down sequence for minimum
power-down current when using the internal charge
pump and the internal clock signal . . . . . . . . . . .27
Fig 8. Recommended power-down sequence when using
an external supplied VLCD and the internal clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Fig 9. Recommended power-down sequence when using
the internal charge pump and an external clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Fig 10. Recommended power-down sequence when using
an external supplied VLCD and an external clock
signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Fig 11. Example of display types suitable for PCA8538 .30
Fig 12. Typical system configuration if using the internal
VLCD generation and I2C-bus . . . . . . . . . . . . . . . .31
Fig 13. Typical system configuration if using the external
VLCD and SPI-bus . . . . . . . . . . . . . . . . . . . . . . . .31
Fig 14. VLCD generation including temperature
compensation . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Fig 15. VLCD programming of PCA8538 (assuming
VT[8:0] = 0h) . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Fig 16. Charge pump model (used to characterize the
driving strength) . . . . . . . . . . . . . . . . . . . . . . . . . .34
Fig 17. Charge pump driving capability with
VDD2 = 3.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Fig 18. Charge pump driving capability with
VDD2 = 5.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Fig 19. VLCD with respect to Iload at VDD2 = 3 V . . . . . . . .37
Fig 20. VLCD with respect to Iload at VDD2 = 5 V . . . . . . . .37
Fig 21. Temperature measurement block with digital
temperature filter . . . . . . . . . . . . . . . . . . . . . . . . .38
Fig 22. Temperature measurement delay . . . . . . . . . . . .39
Fig 23. Example of segmented temperature coefficients.40
Fig 24. Electro-optical characteristic: relative transmission
curve of the liquid. . . . . . . . . . . . . . . . . . . . . . . . .44
Fig 25. Static drive mode waveforms, line inversion mode
(n = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Fig 26. Waveforms for the 1:2 multiplex drive mode, 1⁄2 bias,
line inversion mode (n = 1) . . . . . . . . . . . . . . . . .46
Fig 27. Waveforms for the 1:2 multiplex drive mode, 1⁄3 bias,
line inversion mode (n = 1) . . . . . . . . . . . . . . . . .47
Fig 28. Waveforms for the 1:4 multiplex drive mode, 1⁄3 bias,
line inversion mode (n = 1) . . . . . . . . . . . . . . . . . 48
Fig 29. Waveforms for 1:6 multiplex drive mode, 1⁄3 bias,
line inversion mode (n = 1) . . . . . . . . . . . . . . . . . 49
Fig 30. Waveforms for 1:6 multiplex drive mode, 1⁄4 bias,
line inversion mode (n = 1) . . . . . . . . . . . . . . . . . 50
Fig 31. Waveforms for 1:8 multiplex drive mode, 1⁄4 bias,
line inversion mode (n = 1) . . . . . . . . . . . . . . . . . 51
Fig 32. Waveforms for 1:9 multiplex drive mode with 1⁄4 bias
and line inversion mode (n = 1). . . . . . . . . . . . . . 52
Fig 33. Waveforms for 1:9 multiplex drive mode with 1⁄4 bias
and frame inversion mode . . . . . . . . . . . . . . . . . 53
Fig 34. Display RAM bitmap and bank definition . . . . . . 60
Fig 35. Example of bank selection in 1:4 multiplex mode 61
Fig 36. Example of the Input-bank-select and the
Output-bank-select command with multiplex drive
mode 1:4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Fig 37. Control byte format . . . . . . . . . . . . . . . . . . . . . . . 63
Fig 38. I2C-bus - bit transfer . . . . . . . . . . . . . . . . . . . . . . 64
Fig 39. I2C-bus - definition of START and STOP
conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Fig 40. I2C-bus - system configuration . . . . . . . . . . . . . . 65
Fig 41. Acknowledgement on the I2C-bus. . . . . . . . . . . . 66
Fig 42. I2C-bus protocol - write mode . . . . . . . . . . . . . . . 67
Fig 43. I2C-bus protocol - read mode . . . . . . . . . . . . . . . 67
Fig 44. SPI-bus protocol - data transfer overview . . . . . . 68
Fig 45. SPI-bus example. . . . . . . . . . . . . . . . . . . . . . . . . 69
Fig 46. SPI-bus protocol - read example. . . . . . . . . . . . . 69
Fig 47. SPI-bus protocol - write example . . . . . . . . . . . . 69
Fig 48. Device protection diagram . . . . . . . . . . . . . . . . . 70
Fig 49. Typical IDD1 with respect to temperature . . . . . . . 75
Fig 50. Typical IDD2 with respect to temperature . . . . . . . 75
Fig 51. Typical IDD3 with respect to temperature . . . . . . . 76
Fig 52. Typical IDD(LCD) with respect to temperature . . . . 76
Fig 53. Typical VLCD variation with respect to
temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Fig 54. Typical frame frequency variation with respect to
temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Fig 55. Measurement temperature variation with respect to
temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Fig 56. Driver timing waveforms . . . . . . . . . . . . . . . . . . . 78
Fig 57. I2C-bus timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Fig 58. SPI-bus timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Fig 59. Recommended ITO connections for the I2C
interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Fig 60. Recommended ITO connections for the SPI
interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Fig 61. Cascaded configuration with two PCA8538 with
external VLCD and internal clock . . . . . . . . . . . . . 85
Fig 62. Cascaded configuration with two PCA8538 with
internal VLCD and external clock . . . . . . . . . . . . . 86
Fig 63. Cascade configuration for data reading . . . . . . . 88
Fig 64. Bare die outline of PCA8538UG . . . . . . . . . . . . . 89
Fig 65. Alignment marks . . . . . . . . . . . . . . . . . . . . . . . . . 93
Fig 66. Tray details of PCA8538U. . . . . . . . . . . . . . . . . . 95
Fig 67. Die alignment in the tray . . . . . . . . . . . . . . . . . . . 96
PCA8538
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 26 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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