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M59DR008F100N6 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
M59DR008F100N6 Datasheet PDF : 37 Pages
First Prev 31 32 33 34 35 36 37
M59DR008E, M59DR008F
Table 29. Ordering Information Scheme
Example:
M59DR008E
100 ZB 6 T
Device Type
M59
Architecture
D = Dual Bank Page Mode
Operating Voltage
R = 1.8V
Device Function
008E = 8 Mbit (512Kb x16), Dual Bank: 1/half-1/half partitioning, Top Boot
008F = 8 Mbit (512Kb x16), Dual Bank: 1/half-1/half partitioning, Bottom Boot
Random Speed
100 = 100 ns
120 = 120 ns
Package
N = TSOP48: 12 x 20mm
ZB = FBGA48: 0.75mm pitch
Temperature Range
1 = 0 to 70°C
6 = –40 to 85°C
Option
T = Tape & Reel packing
Devices are shipped from the factory with the memory content erased (to FFFFh).
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the STMicroelectronics Sales Office nearest to you.
Table 30. Revision History
Date
Revision Details
September 1999 First Issue
10/06/99
FBGA Connections change (Table 1, Figure 2A)
tWHGL and tEHGL Specification change (Table 26, 27)
10/20/99
FBGA Package Outline drawing and Mechanical Data change (Table 32, Figure 15)
Daisy Chain diagrams, Package and PCB Connections, added (Figure 16, 17)
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