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M29F800DB55N6E View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
M29F800DB55N6E Datasheet PDF : 53 Pages
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M29F800DT
8
Package mechanical
Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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