LX5250/5252
TM
®
9-Line Multimode SCSI Terminator
PRODUCTION DATA SHEET
PIN NAME
1-, 2-, 3-, 4-, 5-, 6-, 7-, 8-, 9-
FUNCTIONAL PIN DESCRIPTION
DESCRIPTION
Negative signal termination lines for LVD mode. Signal termination lines for SE mode.
1+, 2+, 3+, 4+, 5+, 6+, 7+, 8+, 9+ Positive signal termination lines for LVD mode. Psuedo-ground lines for SE mode.
VTERM
DISCONNECT
Power supply pin for terminator. Connect to SCSI bus VTERM. Must be
decoupled by one 4.7µF low-ESR capacitor for every three terminator devices. It is
absolutely necessary to connect this pin to the decoupling capacitor through a very low
impedance (big traces to PCB). Keeping distances very short from the decoupling
capacitors is somewhat layout dependent and some applications may benefit from high
frequency decoupling with 0.1µF capacitors at VTERM pin.
Enables/Disables terminator. See Power Down Function Table for logic levels
for LX5250 and LX5252.
GND
MASTER/SLAVE
DIFFSENSE
DIFFB
SE
Terminator ground pin. Connect to ground.
Sometimes referred to as M/S pin in this datasheet. Used to select which terminator is the
controlling device. M/S pin High or Open enables the DIFFSENSE output drive. Please
see MASTER/SLAVE Function Table.
This is a dual function pin. It drives the SCSI bus DIFFSENS line. It is also the sense pin
to detect the SCSI bus mode (LVD, SE, or HVD). DIFFSENSE output drive can be
disabled with low level on the M/S pin. Please see DIFFSENSE and MASTER/SLAVE
Function Tables. Internally connected to DIFFB pin through a 20K Ω resistor.
Internally connected to DIFFSENSE pin through a 20K Ω resistor. It can be used as a
mode sense pin when the device is non-controlling terminator (M/S is low). An RC filter
(50K Ω resistor & 4.7µF) is not required on the LX5250 as it has an internal timer.
Single-Ended output; when High, terminator is operating in SE mode.
LVD
Low Voltage Differential output; when High, terminator is operating in LVD mode.
HVD
HEATSINK
High Voltage Differential output; when High, terminator is operating in HVD mode.
Attached to die mounting pad, but not bonded to GND pin. Pins should be considered a
heat sink only, and not a true ground connection. It is recommended that these pins be
connected to ground, but can be left floating.
Copyright © 2002
Rev. 1.2b, 2005-08-29
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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