LTC6912
PACKAGE DESCRIPTIO
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
0.65 ±0.05
4.00 ±0.10
(2 SIDES)
R = 0.20
TYP
R = 0.115
7
TYP
0.38 ± 0.10
12
3.50 ±0.05
1.70 ±0.05
2.20 ±0.05 (2 SIDES)
PIN 1
TOP MARK
PACKAGE OUTLINE (NOTE 6)
0.25 ± 0.05
0.50
BSC
3.30 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.200 REF
3.00 ±0.10 1.70 ± 0.10
(2 SIDES) (2 SIDES)
0.75 ±0.05
0.00 – 0.05
6
1
0.25 ± 0.05
0.50
BSC
3.30 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
PIN 1
NOTCH
(UE12/DE12) DFN 0603
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.254 MIN
.045 ±.005
.150 – .165
.189 – .196*
(4.801 – 4.978)
16 15 14 13 12 11 10 9
.009
(0.229)
REF
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.0165 ± .0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
.007 – .0098
(0.178 – 0.249)
.015 ± .004
(0.38 ± 0.10)
× 45°
0° – 8° TYP
1 234 5678
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
6912fa
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