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LTC4090EDJC(RevA) View Datasheet(PDF) - Linear Technology

Part Name
Description
MFG CO.
LTC4090EDJC Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
LTC4090/LTC4090-5
PACKAGE DESCRIPTION
DJC Package
22-Lead Plastic DFN (6mm × 3mm)
(Reference LTC DWG # 05-08-1714)
3.60 ±0.05
1.65 ±0.05
2.20 ±0.05 (2 SIDES)
0.889
R = 0.10
0.889
0.70 ±0.05
PACKAGE
OUTLINE
5.35 ± 0.05
(2 SIDES)
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. APPLY SOLDER MASK TO AREAS THAT
ARE NOT SOLDERED
3. DRAWING IS NOT TO SCALE
6.00 ±0.10
(2 SIDES)
R = 0.10
12
TYP
R = 0.115
0.889
TYP
0.40 ± 0.05
22
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
3.00 ±0.10 1.65 ± 0.10
(2 SIDES) (2 SIDES)
11
0.75 ±0.05
0.00 – 0.05
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)
IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.889
5.35 ± 0.10
(2 SIDES)
1
0.25 ± 0.05
0.50 BSC
(DJC) DFN 0605
BOTTOM VIEW—EXPOSED PAD
PIN #1 NOTCH
R0.30 TYP OR
0.25mm × 45°
CHAMFER
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
4090fa
27

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