LTC4080EMSE View Datasheet(PDF) - Linear Technology

Part Name

Description

MFG CO.

LTC4080EMSE

500mA Standalone Li-Ion Charger with Integrated 300mA Synchronous Buck

Linear Technology 

LTC4080

PACKAGE DESCRIPTIO

DD Package

10-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1699)

0.675 ±0.05

R = 0.115

TYP

6

0.38 ± 0.10

10

3.50 ±0.05

1.65 ±0.05

2.15 ±0.05 (2 SIDES)

PACKAGE

OUTLINE

PIN 1

TOP MARK

(SEE NOTE 6)

0.25 ± 0.05

0.50

BSC

2.38 ±0.05

(2 SIDES)

0.200 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).

CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

3.00 ±0.10 1.65 ± 0.10

(4 SIDES) (2 SIDES)

0.75 ±0.05

0.00 – 0.05

(DD) DFN 1103

5

1

0.25 ± 0.05

0.50 BSC

2.38 ±0.10

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

MSE Package

10-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1664 Rev B)

2.794 ± 0.102

(.110 ± .004)

0.889 ± 0.127

(.035 ± .005)

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.06 ± 0.102

1

(.081 ± .004)

1.83 ± 0.102

(.072 ± .004)

5.23

(.206)

MIN

2.083 ± 0.102 3.20 – 3.45

(.082 ± .004) (.126 – .136)

0.305 ± 0.038

(.0120 ± .0015)

TYP

0.50

(.0197)

BSC

RECOMMENDED SOLDER PAD LAYOUT

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

10

10 9 8 7 6

0.497 ± 0.076

(.0196 ± .003)

REF

0.254

(.010)

GAUGE PLANE

DETAIL “A”

0° – 6° TYP

4.90 ± 0.152

(.193 ± .006)

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

12345

0.53 ± 0.152

(.021 ± .006)

DETAIL “A”

1.10

(.043)

MAX

0.18

(.007)

SEATING

PLANE 0.17 – 0.27

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

(.007 – .011)

TYP

0.50

(.0197)

BSC

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.86

(.034)

REF

0.1016 ± 0.0508

(.004 ± .002)

MSOP (MSE) 0307 REV B

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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