LTC3619BEDD(RevA) View Datasheet(PDF) - Linear Technology

Part Name

Description

MFG CO.

LTC3619BEDD
(Rev.:RevA)

400mA/800mA Synchronous Step-Down DC/DC with Average Input Current Limit

Linear Technology 

LTC3619B

Package Description

DD Package

10-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1699 Rev B)

0.70 p0.05

R = 0.125

TYP

6

0.40 p 0.10

10

3.55 p0.05

1.65 p0.05

2.15 p0.05 (2 SIDES)

PACKAGE

OUTLINE

0.25 p 0.05

0.50

BSC

2.38 p0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

3.00 p0.10 1.65 p 0.10

(4 SIDES) (2 SIDES)

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.75 p0.05

0.00 – 0.05

(DD) DFN REV B 0309

5

1

0.25 p 0.05

0.50 BSC

2.38 p0.10

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).

CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

18

MSE Package

10-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1664 Rev C)

2.794 p 0.102

(.110 p .004)

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.06 p 0.102

0.889 p 0.127

(.035 p .005)

1

(.081 p .004)

1.83 p 0.102

0.29

REF

(.072 p .004)

5.23

(.206)

MIN

2.083 p 0.102 3.20 – 3.45

(.082 p .004) (.126 – .136)

0.305 p 0.038

(.0120 p .0015)

TYP

0.50

(.0197)

BSC

RECOMMENDED SOLDER PAD LAYOUT

3.00 p 0.102

(.118 p .004)

(NOTE 3)

0.05 REF

DETAIL “B”

CORNER TAIL IS PART OF

DETAIL “B” THE LEADFRAME FEATURE.

10

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

10 9 8 7 6

0.497 p 0.076

(.0196 p .003)

REF

0.254

(.010)

GAUGE PLANE

DETAIL “A”

0o – 6o TYP

4.90 p 0.152

(.193 p .006)

3.00 p 0.102

(.118 p .004)

(NOTE 4)

12345

0.53 p 0.152

(.021 p .006)

DETAIL “A”

1.10

(.043)

MAX

0.18

(.007)

SEATING

PLANE 0.17 – 0.27

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

(.007 – .011)

TYP

0.50

(.0197)

BSC

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.86

(.034)

REF

0.1016 p 0.0508

(.004 p .002)

MSOP (MSE) 0908 REV C

3619bfa

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