datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

LTC3772EDDB View Datasheet(PDF) - Linear Technology

Part Name
Description
MFG CO.
LTC3772EDDB Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
PACKAGE DESCRIPTIO
TS8 Package
8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637)
0.52
0.65
MAX
REF
1.22 REF
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC 1.50 – 1.75
(NOTE 4)
PIN ONE ID
LTC3772
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.65 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
1.95 BSC
0.22 – 0.36
8 PLCS (NOTE 3)
0.01 – 0.10
TS8 TSOT-23 0802
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3772f
19

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]