LTC3728L/LTC3728LX
PACKAGE DESCRIPTIO (For purposes of clarity, drawings are not to scale)
GN Package
28-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.045 ±.005
.386 – .393*
(9.804 – 9.982)
28 27 26 25 24 23 22 21 20 19 18 17 1615
.033
(0.838)
REF
.254 MIN
.150 – .165
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
.0165 ± .0015
RECOMMENDED SOLDER PAD LAYOUT
.0250 TYP
.0075 – .0098
(0.191 – 0.249)
.015 ± .004
(0.38 ± 0.10)
× 45°
0° – 8° TYP
1 2 3 4 5 6 7 8 9 10 11 12 13 14
.053 – .069
(1.351 – 1.748)
.004 – .009
(0.102 – 0.249)
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2.
DIMENSIONS
ARE
IN
INCHES
(MILLIMETERS)
.008 – .012
(0.203 – 0.305)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.0250
(0.635)
BSC
GN28 (SSOP) 0502
5.35 ±0.05
4.20 ±0.05
3.45 ±0.05
(4 SIDES)
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
0.57 ±0.05
5.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
31 32
PIN 1
TOP MARK
0.40 ± 0.10
1
2
3.45 ± 0.10
(4-SIDES)
0.23 ± 0.05 PACKAGE
OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
0.23 ± 0.05
0.50 BSC
(UH) QFN 0102
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3728lxfa
31