LTC2052HVCGN View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
LTC2052HVCGN Datasheet PDF : 12 Pages
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TYPICAL APPLICATIO
LTC2051/LTC2052
Obtaining Ultralow VOS Drift and Low Noise
+
5+
2–
7
1/2 LTC2051
1
1/2 LTC2051
R4
6–
3+
5V
R5
C1
R1
R2
C2
R3
3+ 1 8
6
A1
OUT
–
2–
OUT
20512 F01
A1
R1
R2
R3
LT1677
2.49k
3.01k
340k
LT1012
750Ω
57Ω
250k
R4
R5
C1
C2
eIN (DC – 1Hz) eIN (DC – 10Hz)
10k
100k
0.01μF
0.001μF
0.15μVP-P
0.2μVP-P
10k
100k
0.01μF
0.001μF
0.3μVP-P
0.4μVP-P
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
R = 0.115
TYP
5
0.38 ± 0.10
8
0.675 ±0.05
PIN 1
TOP MARK
(NOTE 6)
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.200 REF
0.75 ±0.05
0.00 – 0.05
4
0.25 ± 0.05
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
3.5 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
(DD) DFN 1203
20512fd
9
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