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LT1468CS8-2(RevB) View Datasheet(PDF) - Linear Technology

Part Name
Description
MFG CO.
LT1468CS8-2
(Rev.:RevB)
Linear
Linear Technology 
LT1468CS8-2 Datasheet PDF : 14 Pages
First Prev 11 12 13 14
LT1468-2
package description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
8-Lead PlaDsDticPaDcFkNag(3emm × 3mm)
8(R-LeefearednPcelaLTsCticDWDFGN# (035m-08m-1×6938mRmev)C)
(Reference LTC DWG # 05-08-1698 Rev C)
0.70 ±0.05
3.5 ±0.05
1.65 ±0.05
2.10 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ±0.05
0.50
BSC
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.125
TYP
5
0.40 ±0.10
8
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
3.00 ±0.10
(4 SIDES)
1.65 ±0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
4
0.25 ±0.05
(DD8) DFN 0509 REV C
1
0.50 BSC
2.38 ±0.10
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
14682fb
12

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