EMIF02-SPK01C2 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

EMIF02-SPK01C2

2 line EMI filter and ESD protection

STMicroelectronics 

EMIF02-SPK01C2

2

Ordering information scheme

Ordering information scheme

EMIF yy - xxx zz Cx

EMI Filter

Number of lines

Information

3 letters = application

2 digits = version

Package

C = Coated Flip-Chip

x = 2: Leadfree Pitch = 500 µm, Bump = 315 µm

3

Package information

Figure 9. Flip-Chip Dimensions

500 µm ± 10

250 µm ± 10

315 µm ± 50

695 µm ± 50

± 15

500 µm

1.07 mm ± 50 µm

Figure 10. Marking

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year ww = week)

E

xxz

y ww

Figure 11. Footprint recommendation

Copper pad Diameter:

250µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 315 µm copper pad diameter

5/7

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