CPC7582MATR View Datasheet(PDF) - Clare Inc => IXYS

Part Name

Description

MFG CO.

CPC7582MATR

Line Card Access Switch

Clare Inc => IXYS 

CPC7582

3.2 Printed-Circuit Board Land Patterns

3.2.1 16-Pin SOIC

1.27

(0.050)

3.2.2 16-Pin DFN

0.35

(0.014)

2.00

(0.079)

9.40

(0.370)

1.05

(0.041)

5.80

(0.228)

0.60

(0.024)

DIMENSIONS

mm

(inches)

0.80

(0.031)

DIMENSIONS

mm

(inches)

NOTE: Because the metallic pad on the bottom of the

DFN package is connected to the substrate of the die,

Clare recommends that no printed circuit board traces

or vias be placed under this area to maintain minimum

creepage and clearance values.

3.3 Tape and Reel Packaging

3.3.1 16-Pin SOIC

Tape and Reel Packaging for 16-Pin SOIC Package

330.2 Dia

(13.00 Dia)

Pin 1

B0=10.70 + 0.15

(0.421 + 0.01)

Top Cover

Tape Thickness

0.102 Max

(0.004 Max)

Top Cover

Tape

W=16.00 + 0.30

(0.630 + 0.010)

Embossed

Carrier

Embossment

K0=3.20 + 0.15

(0.193 + 0.01)

K =2.70 + 0.15

1

(0.106 + 0.01)

P=12.00

(0.47)

User Direction of Feed

A0=10.90 + 0.15

(0.429 + 0.010)

Dimensions

mm

(inches)

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

18

www.clare.com

R05

Share Link: